The road to breakthrough for local enterprises
The road to breakthrough for local enterprises
As a “hidden champion” in the field of domestic semiconductor materials, Huake New Materials has gone through five years of technical breakthroughs:
2019: Formed a 30-person special team and established a joint laboratory with the Institute of Chemistry of the Chinese Academy of Sciences
2022: Completed the pilot test, but delamination failure occurred in the packaging test of a mobile phone processor
2024: Breakthrough in the key technology of “nanoscale inorganic filler surface grafting” to solve the problem of CTE (thermal expansion coefficient) matching
“The most difficult time was to scrap 37 batches of raw materials in a row,” recalled Wang Lei, the head of the R&D team, “until we found that plasma treatment of silica particles can reduce CTE from 180ppm/K to 8.2ppm/K, which is a perfect match with the chip substrate.”