Core technical parameters are benchmarked against international standards
Core technical parameters are benchmarked against international standards
The HK-700 series sealants developed by Huake New Materials have achieved three major breakthroughs:
Ultra-low dielectric constant: 3.1 (@1GHz), 15% lower than imported products, reducing high-frequency signal transmission losses
Ultimate purity control: metal ion content <0.5ppm (total of sodium, potassium, and chloride ions), meeting SEMI G5 standards
Thermal stability has increased: after 1,000 hot and cold cycles from -55°C to 150°C, the bonding strength retention rate is 92%
“Traditional encapsulation glue is prone to microbubbles when cured at low temperatures, while HK-700 uses original siloxane modification technology to achieve complete curing in 10 minutes at 85°C, with porosity controlled below 0.01%.” Dr. Zhang Weiming, CTO of Huake New Materials, showed the comparison images under an electron microscope.